* device mounted on ceramic pcb: 7.6mm x 9.4mm x 0.87mm with pad areas 25 mm 2 thru bzt52 b 39s 200 mw zener diode 4.3 to 39 volts features x planar die construction x 200mw power dissipation on ceramic pcb x general purpose medium current x ideally suited for automated assembly processes absolute maximum ratings symbol parameter rating unit p d power dissipation 200 mw t j junction temperature -65 to +175 : t stg storage temperature range -65 to +175 : absolute maximum ratings symbol parameter rating unit r thja thermal resistance junction to ambient* 305 : /w electrical characteristics symbol parameter rating unit v f maximum forward voltage (i f =10madc) 0.9 v bzt52b4v3s www. mccsemi .com mcc
omp onents 20736 marilla street chatsworth
tm micro commercial components 1 of 3 ? lead free finish/rohs compliant("p" suffix designates rohs compliant. see ordering information) revision: a 2011/01/01 dimensions inches mm dim min m a x min m a x note a .090 .107 2.30 2.70 b .063 .071 1.60 1.80 c .045 .053 1.15 1.35 d .031 .045 0.80 1.15 e .010 .016 0.25 0.40 g .004 .018 0.10 0.45 h .004 .010 0.10 0.25 j ----- .006 ----- 0.15 a b e c j d h g sod - 323 0.022 0.074" 0.027 suggested solder pad layout epoxy meets ul 94 v-0 flammability rating moisture sensitivity level 1
www. mccsemi .com 2 of 3 mcc tm micro commercial components revision: 2000 2 4v3 3 min. nom. max. i zt (ma) max. i zk (ma) max. ua v bzt52b4v3s 4.21 4.3 4.39 5 90 1 600 3 1 -3.5 0 w7 bzt52b4v7s 4.61 4.7 4.79 5 80 1 500 3 2 -3.5 0.2 w8 bzt52b5v1s 5.0 5.1 5.2 5 60 1 480 2 2 -2.7 1.2 w9 bzt52b5v6s 5.49 5.6 5.71 5 40 1 400 1 2 -2 2.5 wa bzt52b6v2s 6.08 6.2 6.32 5 10 1 150 3 4 0.4 3.7 wb bzt52b6v8s 6.66 6.8 6.94 5 15 1 80 2 4 1.2 4.5 wc bzt52b7v5s 7.35 7.5 7.65 5 15 1 80 1 5 2.5 5.3 wd bzt52b8v2s 8.04 8.2 8.36 5 15 1 80 0.7 5 3.2 6.2 we bzt52b9v1s 8.92 9.1 9.28 5 15 1 100 0.5 6 3.8 7 wf bzt52b10s 9.8 10 10.2 5 20 1 150 0.2 7 4.5 8 wg bzt52b11s 10.78 11 11.22 5 20 1 150 0.1 8 5.4 9 wh bzt52b12s 11.76 12 12.24 5 25 1 150 0.1 8 6 10 wi bzt52b13s 12.74 13 13.3 5 30 1 170 0.1 8 7 11 wk bzt52b15s 14.7 15 15.3 5 30 1 200 0.1 10.5 9.2 13 wl bzt52b16s 15.68 16 16.3 5 40 1 200 0.1 11.2 10.4 14 wm bzt52b18s 17.6 18 18.4 5 45 1 225 0.1 12.6 12.4 16 wn bzt52b20s 19.6 20 20.4 5 55 1 225 0.1 14 14.4 18 wo bzt52b22s 21.56 22 22.44 5 55 1 250 0.1 15.4 16.4 20 wp bzt52b24s 23.52 24 24.5 5 70 1 250 0.1 16.8 18.4 22 wr bzt52b27s 26.46 27 27.54 2 80 0.5 300 0.1 18.9 21.4 25.3 ws bzt52b30s 29.4 30 30.6 2 80 0.5 300 0.1 21 24.4 29.4 wt bzt52b33s 32.34 33 33.7 2 80 0.5 325 0.1 23.1 27.4 33.4 wu bzt52b36s 35.28 36 36.72 2 90 0.5 350 0.1 25.2 30.4 37.4 ww bzt52b39s 38.22 39 39.8 2 130 0.5 350 0.1 27.3 33.4 41.2 wx (1) device mounted on ceramic pcb: 7.6mm x 9.4mm x 0.87mm with pad areas 25 mm 2 (2) f=1khz typical temperature coefficient @i ztc mv/ marking type zener voltage vz (1) volts maximum zener impedance (2) z zt (ohms) maximum zener impedance (2) z zk (ohms) reverse current i r (max)@v r
mcc tm micro commercial components www. mccsemi .com 3 3 device packing part number-tp tape&reel: 3 kpcs/reel ordering information : *** i m p o r t a n t n o t ic e * ** m i c r o c o m m e r c i a l c o m p on e n ts c o r p . r e s e rve s t h e r i g h t t o m a k e c h a n g e s w i t ho u t f u r t h e r no t i c e t o a n y p r o d u c t h e r e i n t o m a k e c o rr e c t i o n s , m o d i f i c a t i o n s , e n h a n c e m e n t s , i m pr o v e m e n t s , o r o t h e r ch a n g e s . m i c r o c o m m e r c i a l c o mp o n e n ts c o r p . d o e s n o t a s s u m e a n y l i a b i l i t y a r i s i n g ou t o f t h e a p p l i c a t i on o r u s e o f a n y p r o d uc t d e sc r i be d h e r e i n ; n e i t h e r d o e s i t c o n v e y a n y li c e n s e un der i t s p a t e n t r i g h t s , n o r t h e r i g h t s o f o t h e r s . t h e u s e r o f pr o d uc t s i n s u c h a p p l i c a t i o n s sh a l l a ss u m e a l l r i s k s o f su c h u s e a n d w ill a g r ee t o h o l d m i c r o c o mm er c i a l c o m p o n e n t s c o r p . a n d a ll t h e c o m p a n i e s w ho s e p r o d u c t s a r e r e p r e s e n t ed o n ou r w e b s i t e , h a r m l e s s a g a i n s t a l l d a m a g e s. * * * l i f e s u p p o r t *** m c c ' s pr o d uc t s a r e n o t a u t h o r iz ed f o r u s e a s c r i t i c a l c o m p o n e n t s i n l i f e s u pp o r t d e v i c e s o r s y s t e m s w i t h ou t t h e e x pre ss wr i tt e n a p p r o v a l o f m i c r o c o mm e r c i a l c o m p o n e n t s c o rp o r a t i o n. * * * c u s t o m e r a w a r e n e ss*** c o un t e r f e i t i n g o f s e m i c o n d u c t o r p a r t s i s a gr o w i n g p r o b l e m i n t h e i n d u s t ry . m i c r o c o mm e r c i a l c o m p o n e n t s ( m cc ) i s t a k i n g s t r o n g m e a su r e s t o p r o t e c t ou r s e l v e s a n d o u r cu s t o m e r s f r o m t h e pr o l i f e r a t i on o f c o u n t e r f e i t p a r t s . m c c s t r o n g l y e nc o u r a g e s c u s t o m e r s t o p u r c h a s e m c c p a r t s e i t h e r d i r e c t l y f r o m m c c o r f r o m a u t ho r i z e d m c c d i s t r i b u t o r s w ho a r e l i s t e d b y c o u n t r y o n o u r w e b p a g e c i t ed below . p r o d uc t s c us t o m e r s b u y e i t h e r f r o m m c c d i r e c t l y o r f r o m a u t ho r i z e d m cc d i s t r i b u t o r s a r e g e n u i n e p a r t s , h a v e f ul l t r a c e a b il i t y , m e e t m c c ' s q u a l i t y s t a n d a r d s f o r h a n d li n g a n d s t o r a g e . m c c wi l l n o t p r o v i d e a n y w a rr a n ty c o v e r a g e o r o t h e r a s s i s t a n c e f o r p a r ts b o u g h t f r o m u n a u t h o r i z e d s o u r c e s. m c c i s c o m m i t t e d t o c o m b a t t h i s g l o b a l pr o b l e m a n d e n c ou r a g e o u r c u s t o m e r s t o d o t h e i r p a r t in s t o p p i n g t h i s p r a c t i c e b y b u y i n g d i r e c t o r f r o m a u t h o r i z ed d i s t r i b u t o r s.
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